Current Research Topics

Smart materials such as shape memory polymers (SMPs) offer significant potential for integration with biomimetic design strategies to create synthetic surfaces with diverse functionalities, including adhesion, wetting, and optical control. Our group has been exploring the bioinspired design of micro/nanostructured SMP and composite surfaces that exhibit reversible dry adhesion, tunable wetting, and adaptive light manipulation enabled by dynamically switchable structural and material properties. 

We propose a novel approach for double-sided semiconductor processing on ultrathin (<10 μm) silicon (UTSi) using self-delamination interfaces. Double-sided device fabrication offers significant advantages by increasing device density and enabling distinct functionalities on the front and back surfaces. This approach provides a new pathway toward next-generation semiconductor manufacturing and flexible electronics. 

Transfer printing, which relies on switchable adhesion to polymer stamps, is a powerful technique for the deterministic assembly of micro- and nanomaterials into spatially organized, functional architectures in both two and three dimensions. Our group focuses on developing transfer printing-based manufacturing technologies for advanced semiconductor, display, and MEMS platforms, with applications in semiconductor packaging, micro-LED integration, and 3D MEMS assembly. 

Building on our manufacturing expertise, our group develops flexible electronic devices for energy harvesting and motion sensing through innovative design, fabrication, and optimization.